IT-1030
Negative Photo Resist Stripper
IT-1030 is a photo resist stripper exclusively developed for wafer level packaging process, and a high functional solvent type bulk PR stripper to remove negative PR.
[Features]
• Exclusively developed for wafer bumping
• A bulk stripper which removes negative PR without ash/etch residue
• Removes PR without oxidation or damage to bump metal or bump metal substances
• Wide range of treatment condition (temp. & time)
• Evaporation loss is little due to high boiling point (180℃)
| Before | After |
|---|---|
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[ Operation guideline ]
[ Product information ]
| Bath Life | >24 hours |
|---|---|
| Freezing Point | -10℃ |
| Boiling Point | >180℃ |
| Solubility in Water | 100% |
| Specific Gravity | 1.12kg/L |
| pH(10% in H20) | 12.54 |
[ Metal etching rate (Literature material) ]
(Unit : Å/min)
| Temp. | SiC | SiN | SiO2 | TEOS | Ti | TiN | W |
|---|---|---|---|---|---|---|---|
| 45℃ | <1 | <1 | <1 | <1 | <1 | <1 | <1 |
| 65℃ | <1 | <1 | <1 | <1 | <1 | <1 | <1 |
[ Metal component analysis ]
(Unit : ppb)
| Li | Na | Mg | Al | K | Ca | Cr | Mn | Fe | Co | Ni | Cu |
|---|---|---|---|---|---|---|---|---|---|---|---|
| <100 | <100 | <100 | <100 | <100 | <100 | <100 | <100 | <100 | <100 | <100 | <100 |
