JYTA-series
Thermal radiation copper pin
[Application]
Used for smart power module(SPM), intelligent power module(IPM) and etc. which are key components of inverter
[Structure]
[Properties]
| Item | Measurement | Value | |
|---|---|---|---|
| Thickness | ㎛ | 580 ± 2% | |
| Thermal conductivity* (Resin layer vertical direction) |
W/mK | 1.83 | |
| Insulation properties | Horizontal | – | 5KV, 10^4MΩ ↑ |
| Vertical | – | 5KV, 10^4MΩ ↑ | |
*: ASTM D 5470
[Condition of adhesion and hardening]
| Lead frame bonding | 135℃ / 10kgf / 1min. |
|---|---|
| Complete hardening | 160℃ / 2hrs. |
 |
 |
