Electronic Material


Thermal radiation copper pin


Used for smart power module(SPM), intelligent power module(IPM) and etc. which are key components of inverter



Item Measurement Value
Thickness 580 ± 2%
Thermal conductivity*
(Resin layer vertical direction)
W/mK 1.83
Insulation properties Horizontal 5KV, 10^4MΩ ↑
Vertical 5KV, 10^4MΩ ↑

*: ASTM D 5470

[Condition of adhesion and hardening]

Lead frame bonding 135℃ / 10kgf / 1min.
Complete hardening 160℃ / 2hrs.