JCF-1060
Conductive Bonding Film
JCF-1060 is thermosetting conductive bonding film developed by conductive adhesive compounding technology in conjunction with film manufacturing technology. Since adhesive layer of JCF-1060 is conductive, it can bond FPC which contains component assembly such as camera module or LCD module of cell phones to stiffener, and also provides EMI shielding function.
[ Application ]
• To adhere and electrically conduct FPC and metal stiffener
[ Features ]
• Outstanding adhesion to stiffener (Ni/SUS, Nickel silver)
• Strengthens GND by conducting GND pattern of FPC to metal stiffener with stable conductivity
• High tolerance to moisture and heat
[ Structure ]
[ Process condition ]
| Recommended process | |
|---|---|
| Pre-bonding | 130℃ x 6kgf/㎠ x 1sec. |
| Final bonding | 150℃ x 30kgf/㎠ x 30min. |
[ Product Information ]
| Size | Length : >20m, width : 30~500mm |
| Storage | Cold storage under 4℃ |
| Shelf life | 6 months |
[ Properties ]
| Item | Unit | Value | Test method | ||
|---|---|---|---|---|---|
| Thickness | μm | 60 | Digital gage | ||
| Density | g/cm3 | 2.4 | Density cup | ||
| Tensile strength | N/㎠ | 332 | ASTM D 1000 | ||
| Tg | ℃ | 173.6 | DSC | ||
| Heat conductivity | W/mK | 2.78 | ASTM D 5470 | ||
| Resistance | Surface resistance | Film | Ω/□ | 8.09X10-2 | JIS K 7194 |
| After press* | 9.34X10-3 | ||||
| Volume resistance | Film | Ω*㎝ | 4.85X10-4 | JIS K 7194 | |
| After press* | 5.59X10-5 | ||||
| Adhesion strength | PI, Ni-SUS | N/㎝ | > 8 | 90°, 50mm/min.
Peel-off test |
|
| Cu, Ni-SUS | > 7 | ||||
* : Tested after final bonding of Ni-SUS and JCF-1060
[ Environmental effect ]
| Environmental regulation | JCF-1060 |
|---|---|
| ROHS | OK |
| Halogen free | OK |
| Pb, Cd, Cr VI, Hg free | OK |
