JYTA-series
Thermal Radiatin Copper Pin for Semiconductor Chip
[Features]
• Durable and no corrosion occurs on the surface in high temperature
• Insulates well in high temperature (120~130℃)
• Maximizes heat radiation performance by high thermal conductivity (through)
• Semi hardening type bonding layer with high adhesivity to lead frame
[ Application ]
• Used for smart power module(SPM), intelligent power module(IPM) and etc. which are key components of inverter
[ Structure ]
[ Properties ]
| Item | Measurement | Value | |
|---|---|---|---|
| Thickness | ㎛ | 580 ± 2% | |
| Thermal conductivity*
(Resin layer vertical direction) |
W/mK | 1.83 | |
| Insulation properties | Horizontal | – | 5KV, 10^4MΩ ↑ |
| Vertical | – | 5KV, 10^4MΩ ↑ | |
*: ASTM D 5470
[ Condition of adhesion and hardening ]
| Lead frame bonding | 135℃ / 10kgf / 1min. |
| Complete hardening | 160℃ / 2hrs. |
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