{"id":275,"date":"2018-04-13T15:04:32","date_gmt":"2018-04-13T06:04:32","guid":{"rendered":"http:\/\/wptest2.mir9.co.kr\/?page_id=275"},"modified":"2018-05-07T13:26:05","modified_gmt":"2018-05-07T04:26:05","slug":"it-1030","status":"publish","type":"page","link":"https:\/\/www.cychem.co.kr\/en\/product\/semiconductor-grade\/it-1030\/","title":{"rendered":"IT-1030"},"content":{"rendered":"

IT-1030<\/p>\n<\/div><\/section>\n

Negative Photo Resist Stripper<\/p>\n<\/div><\/section>\n

IT-1030 <\/strong>is a photo resist stripper exclusively developed for wafer level packaging process, \u00a0and a high functional solvent type bulk PR stripper to remove negative PR.<\/p>\n<\/div><\/section>\n

[Features]<\/p>\n<\/div><\/section>\n

\u2022 Exclusively developed for wafer bumping
\n\u2022 A bulk stripper which removes negative PR without ash\/etch residue
\n\u2022 Removes PR without oxidation or damage to bump metal or bump metal substances
\n\u2022 Wide range of treatment condition (temp. & time)
\n\u2022 Evaporation loss is little due to high boiling point (180\u2103)<\/p>\n<\/div><\/section>\n

\n\n\n\n\n
Before<\/th>\nAfter<\/th>\n<\/tr>\n<\/thead>\n
\"\"<\/td>\n\"\"<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section>\n

[ Operation guideline ]<\/p>\n<\/div><\/section>\n

\"\"<\/p>\n<\/div><\/section>\n

[ Product information ]<\/p>\n<\/div><\/section>\n

\n\n\n\n\n\n\n\n
Bath Life<\/th>\n>24 hours<\/td>\n<\/tr>\n
Freezing Point<\/th>\n-10\u2103<\/td>\n<\/tr>\n
Boiling Point<\/th>\n>180\u2103<\/td>\n<\/tr>\n
Solubility in Water<\/th>\n100%<\/td>\n<\/tr>\n
Specific Gravity<\/th>\n1.12kg\/L<\/td>\n<\/tr>\n
pH(10% in H20)<\/th>\n12.54<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section>\n

[ Metal etching rate (Literature material) ]<\/p>\n<\/div><\/section>\n

(Unit : \u00c5\/min)<\/p>\n\n\n\n\n\n\n
Temp.<\/th>\nSiC<\/th>\nSiN<\/th>\nSiO2<\/th>\nTEOS<\/th>\nTi<\/th>\nTiN<\/th>\nW<\/th>\n<\/tr>\n<\/thead>\n
45\u2103<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<\/tr>\n
65\u2103<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<1<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section>\n

[ Metal component analysis ]<\/p>\n<\/div><\/section>\n

(Unit : ppb)<\/p>\n\n\n\n\n\n
Li<\/th>\nNa<\/th>\nMg<\/th>\nAl<\/th>\nK<\/th>\nCa<\/th>\nCr<\/th>\nMn<\/th>\nFe<\/th>\nCo<\/th>\nNi<\/th>\nCu<\/th>\n<\/tr>\n<\/thead>\n
<100<\/td>\n<100<\/td>\n<100<\/td>\n<100<\/td>\n<100<\/td>\n<100<\/td>\n<100<\/td>\n<100<\/td>\n<100<\/td>\n<100<\/td>\n<100<\/td>\n<100<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section><\/div>","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"parent":210,"menu_order":4,"comment_status":"closed","ping_status":"closed","template":"template-page.php","meta":[],"_links":{"self":[{"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages\/275"}],"collection":[{"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/comments?post=275"}],"version-history":[{"count":7,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages\/275\/revisions"}],"predecessor-version":[{"id":1030,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages\/275\/revisions\/1030"}],"up":[{"embeddable":true,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages\/210"}],"wp:attachment":[{"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/media?parent=275"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}