{"id":168,"date":"2018-04-13T10:40:46","date_gmt":"2018-04-13T01:40:46","guid":{"rendered":"http:\/\/wptest2.mir9.co.kr\/?page_id=168"},"modified":"2018-05-17T15:30:35","modified_gmt":"2018-05-17T06:30:35","slug":"electronic-material","status":"publish","type":"page","link":"https:\/\/www.cychem.co.kr\/en\/business-introduction\/electronic-material\/electronic-material\/","title":{"rendered":"CBF (Conductive Bonding Film)"},"content":{"rendered":"

CBF (Conductive Bonding Film)<\/p>\n<\/div><\/section>\n

JCF-1060<\/strong> is thermosetting conductive bonding film developed by conductive adhesive compounding technology in conjunction with film manufacturing technology. Since adhesive layer of JCF-1060 is conductive, it can bond FPC which contains component assembly such as camera module or LCD module of cell phones to stiffener, and also provides EMI shielding function.<\/p>\n<\/div><\/section>\n

[Application]<\/p>\n<\/div><\/section>\n

\u2022 To adhere and electrically conduct FPC and metal stiffener<\/p>\n<\/div><\/section>\n

[Features]<\/p>\n<\/div><\/section>\n

\u2022 Outstanding adhesion to stiffener (Ni\/SUS, Nickel silver)
\n\u2022 Strengthens GND by conducting GND pattern of FPC to metal stiffener with stable conductivity
\n\u2022 High tolerance to moisture and heat<\/p>\n<\/div><\/section>\n

[Structure]<\/p>\n<\/div><\/section>\n

<\/div><\/div><\/div>

[Process conditions]<\/p>\n<\/div><\/section>\n

\n\n\n\n\n\n
<\/th>\nRecommended process<\/th>\n<\/tr>\n<\/thead>\n
Pre-bonding<\/td>\n130\u2103 x 6kgf\/\u33a0 x 1sec.<\/td>\n<\/tr>\n
Final bonding<\/td>\n150\u2103 x 30kgf\/\u33a0 x 30min.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section>\n

[Product information]<\/p>\n<\/div><\/section>\n

\n\n\n\n\n\n
Size<\/th>\nLength : >20m, width : 30~500mm<\/th>\n<\/tr>\n<\/thead>\n
Storage<\/td>\nCold storage below 4\u2103<\/td>\n<\/tr>\n
Shelf life<\/td>\n6 months<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section>\n

[Properties]<\/p>\n<\/div><\/section>\n

\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Item<\/th>\nUnit<\/th>\nValue<\/th>\nTest method<\/th>\n<\/tr>\n
Thickness<\/td>\n\u03bcm<\/td>\n60<\/td>\nDigital gage<\/td>\n<\/tr>\n
Density<\/td>\ng\/cm3<\/td>\n2.4<\/td>\nDensity cup<\/td>\n<\/tr>\n
Tensile strength<\/td>\nN\/\u33a0<\/td>\n332<\/td>\nASTM D 1000<\/td>\n<\/tr>\n
Tg<\/td>\n\u2103<\/td>\n173.6<\/td>\nDSC<\/td>\n<\/tr>\n
Heat conductivity<\/td>\nW\/mK<\/td>\n2.78<\/td>\nASTM D 5470<\/td>\n<\/tr>\n
Resistance<\/td>\nSurface resistance<\/td>\nFilm<\/td>\n\u2126\/\u25a1<\/td>\n8.09X10-2<\/td>\nJIS K 7194<\/td>\n<\/tr>\n
After press*<\/td>\n9.34X10-3<\/td>\n<\/tr>\n
Volume resistance<\/td>\nFilm<\/td>\n\u2126*\u339d<\/td>\n4.85X10-4<\/td>\nJIS K 7194<\/td>\n<\/tr>\n
After press*<\/td>\n5.59X10-5<\/td>\n<\/tr>\n
Adhesion strength<\/td>\nPI, Ni-SUS<\/td>\nN\/\u339d<\/td>\n> 8<\/td>\n90\u00b0, 50mm\/min.<\/p>\n

Peel-off test<\/td>\n<\/tr>\n

Cu, Ni-SUS<\/td>\n> 7<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

* : Tested after final bonding of Ni-SUS and JCF-1060<\/p>\n<\/div><\/section>\n

[Environmental effect]<\/p>\n<\/div><\/section>\n

\n\n\n\n\n\n
Environmental regulatiEnvironmental regulon<\/th>\nJCF-1060<\/th>\n<\/tr>\n
ROHS<\/td>\nOK<\/td>\n<\/tr>\n
Halogen free<\/td>\nOK<\/td>\n<\/tr>\n
Pb, Cd, Cr VI, Hg free<\/td>\nOK<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section>\n
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