{"id":162,"date":"2018-04-13T10:39:42","date_gmt":"2018-04-13T01:39:42","guid":{"rendered":"http:\/\/wptest2.mir9.co.kr\/?page_id=162"},"modified":"2018-04-30T15:03:46","modified_gmt":"2018-04-30T06:03:46","slug":"electrical-and-electronics-process-chemical","status":"publish","type":"page","link":"https:\/\/www.cychem.co.kr\/en\/business-introduction\/surface-treatment-agent\/electrical-and-electronics-process-chemical\/","title":{"rendered":"Electrical and Electronics Process Chemical"},"content":{"rendered":"<div class=\"flex_column av_one_full  flex_column_div av-zero-column-padding first  \" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz24 black mb15 '   itemprop=\"text\" ><p>Electrical and Electronics Process Chemical<\/p>\n<\/div><\/section>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz24 black medium bullet_tit '   itemprop=\"text\" ><p>Positive PR Stripper<\/p>\n<\/div><\/section>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><p><strong>IT-1026<\/strong> was exclusively developed for photoresist stripping of wafer level packaging process of semiconductor, and is a high functional bulk PR stripper suitable for positive PR stripping.<\/p>\n<\/div><\/section><\/div>\r\n\r\n<div class=\"flex_column av_one_full  flex_column_div av-zero-column-padding first  \" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz20 black medium '   itemprop=\"text\" ><p>[Features]<\/p>\n<\/div><\/section>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz14 '   itemprop=\"text\" ><p>\u2022 Shows fast stripping speed compared to other solvents<br \/>\n\u2022 No residue left after PR stripping<br \/>\n\u2022 High functional bulk stripper for positive PR, and perfectly cleans without ash\/etch residue<br \/>\n\u2022 Excellently removes PR without damage or oxidation on bump metal or substrates<br \/>\n\u2022 Conditions of stripping process are flexible to change such as temperature, duration, etc<\/p>\n<\/div><\/section><\/div>\r\n\r\n<div class=\"flex_column av_one_full  flex_column_div av-zero-column-padding first  \" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz20 black medium '   itemprop=\"text\" ><p>PR Etching Rate (PR Thickness : 5,30\u03bcm, Temp : 50 \u2103)<\/p>\n<\/div><\/section>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock image_table '   itemprop=\"text\" ><table>\n<thead>\n<tr>\n<th>PR Thickness<\/th>\n<th>\u201cA\u201d Company<\/th>\n<th>\u201cB\u201d Company<\/th>\n<th>IT-1026<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>E\/R for 5\u03bcm PR<\/td>\n<td>0.4\u03bcm \/sec.<\/td>\n<td>0.5\u03bcm \/sec.<\/td>\n<td>0.6\u03bcm \/sec.<\/td>\n<\/tr>\n<tr>\n<td>E\/R for 30\u03bcm PR<\/td>\n<td>0.8\u03bcm \/sec.<\/td>\n<td>1.1\u03bcm \/sec.<\/td>\n<td>1.3\u03bcm \/sec.<\/td>\n<\/tr>\n<tr>\n<td>PR Thickness<\/td>\n<td>\u201cA\u201d Company<\/td>\n<td>\u201cB\u201d Company<\/td>\n<td>IT-1026<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section><\/div>\r\n\r\n<div class=\"flex_column av_one_full  flex_column_div av-zero-column-padding first  \" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz20 black medium '   itemprop=\"text\" ><p>[IT-1026 Application]<\/p>\n<\/div><\/section>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock image_table '   itemprop=\"text\" ><table>\n<thead>\n<tr>\n<th>Before<\/th>\n<th>after<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td><img decoding=\"async\" loading=\"lazy\" class=\"alignnone size-full wp-image-493\" src=\"http:\/\/www.cychem.co.kr\/en\/wp-content\/uploads\/sites\/4\/2018\/04\/elec1.jpg\" alt=\"\" width=\"316\" height=\"236\" \/><\/td>\n<td><img decoding=\"async\" loading=\"lazy\" class=\"alignnone size-full wp-image-494\" src=\"http:\/\/www.cychem.co.kr\/en\/wp-content\/uploads\/sites\/4\/2018\/04\/elec2.jpg\" alt=\"\" width=\"316\" height=\"235\" \/><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section><\/div>\r\n\r\n<div class=\"flex_column av_one_full  flex_column_div av-zero-column-padding first  \" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz24 black medium bullet_tit '   itemprop=\"text\" ><p>Negative PR Stripper<\/p>\n<\/div><\/section>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><p><strong>IT-1030<\/strong> was exclusively developed for photoresist stripping of wafer level packaging process of semiconductor, and is a solvent type bulk PR stripper suitable for negative PR stripping.<\/p>\n<\/div><\/section><\/div>\r\n\r\n<div class=\"flex_column av_one_full  flex_column_div av-zero-column-padding first  \" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz20 black medium '   itemprop=\"text\" ><p>[Features]<\/p>\n<\/div><\/section>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz14 '   itemprop=\"text\" ><p>\u2022 IT-1030 was exclusively developed for PR stripping of wafer bumping.<br \/>\n\u2022 High functional bulk stripper for negative PR, and perfectly cleans without ash\/etch residue<br \/>\n\u2022 Excellently removes PR without damage or oxidation on bump metal or substrates<br \/>\n\u2022 Conditions of stripping process are flexible to change such as temperature, duration, etc.<\/p>\n<\/div><\/section><\/div>\r\n\r\n<div class=\"flex_column av_one_full  flex_column_div av-zero-column-padding first  \" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz20 black medium '   itemprop=\"text\" ><p>Metal Etching Rate (\u00c5\/min.)<\/p>\n<\/div><\/section>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock image_table case3 '   itemprop=\"text\" ><table>\n<thead>\n<tr>\n<th>Temp.<\/th>\n<th>SiC<\/th>\n<th>SiN<\/th>\n<th>SiO2<\/th>\n<th>TEOS<\/th>\n<th>Ti<\/th>\n<th>TiN<\/th>\n<th>W<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>45\u2103<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<\/tr>\n<tr>\n<td>65\u2103<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<td>&lt;1<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section><\/div><div class=\"flex_column av_one_full  flex_column_div av-zero-column-padding first  \" style='border-radius:0px; '><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock fz20 black medium '   itemprop=\"text\" ><p>[IT-1030 Application]<\/p>\n<\/div><\/section>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock image_table '   itemprop=\"text\" ><table>\n<thead>\n<tr>\n<th>Before(gold bumps)<\/th>\n<th>After (50\u2103, 20min.)<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td><img decoding=\"async\" loading=\"lazy\" class=\"alignnone size-full wp-image-491\" src=\"http:\/\/www.cychem.co.kr\/en\/wp-content\/uploads\/sites\/4\/2018\/04\/elec3.jpg\" alt=\"\" width=\"316\" height=\"236\" \/><\/td>\n<td><img decoding=\"async\" loading=\"lazy\" class=\"alignnone size-full wp-image-492\" src=\"http:\/\/www.cychem.co.kr\/en\/wp-content\/uploads\/sites\/4\/2018\/04\/elec4.jpg\" alt=\"\" width=\"316\" height=\"236\" \/><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/section><\/div>","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"parent":29,"menu_order":4,"comment_status":"closed","ping_status":"closed","template":"template-page.php","meta":[],"_links":{"self":[{"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages\/162"}],"collection":[{"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/comments?post=162"}],"version-history":[{"count":4,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages\/162\/revisions"}],"predecessor-version":[{"id":1168,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages\/162\/revisions\/1168"}],"up":[{"embeddable":true,"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/pages\/29"}],"wp:attachment":[{"href":"https:\/\/www.cychem.co.kr\/en\/wp-json\/wp\/v2\/media?parent=162"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}